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New Chips JU calls open 8 July

Published on | 3 weeks ago

Programmes Digital, Industry & Space Semiconductors

The Chips JU announces the opening of new calls on 8 July, aiming to drive progress in key areas of Europe’s semiconductor strategy by advancing low-power Edge AI design, enabling next-generation substrates, and strengthening international cooperation.

๐—–๐—ต๐—ถ๐—ฝ๐˜€ ๐—ณ๐—ผ๐—ฟ ๐—˜๐˜‚๐—ฟ๐—ผ๐—ฝ๐—ฒ ๐—–๐—ฎ๐—น๐—น๐˜€ ๐—ข๐—ฝ๐—ฒ๐—ป๐—ถ๐—ป๐—ด:
• Low-power Edge AI Chips
• Accelerator for Advanced Strained Silicon on Insulator Substrates
• Open-source EDA tools development (second phase)

๐—˜๐—–๐—ฆ ๐—ฅ&๐—œ ๐—–๐—ฎ๐—น๐—น๐˜€ ๐—ข๐—ฝ๐—ฒ๐—ป๐—ถ๐—ป๐—ด:
• Boosting R&I cooperation between EU and Japan on semiconductors
• RISC-V Automotive Hardware Platform (second phase)
• AI-assisted Methods and Tools for Engineering Automation (second phase)
• Global RIA call (second phase)
• Global IA call according to SRIA 2025 (second phase)

๐Ÿ”— More information on the Chips JU website.

Please note: The second phase of the calls launched earlier this year will also open this upcoming monthexclusively for proposals that were successful in the first phase.

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