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Published on | 3 weeks ago
Programmes Digital, Industry & Space SemiconductorsThe Chips JU announces the opening of new calls on 8 July, aiming to drive progress in key areas of Europe’s semiconductor strategy by advancing low-power Edge AI design, enabling next-generation substrates, and strengthening international cooperation.
๐๐ต๐ถ๐ฝ๐ ๐ณ๐ผ๐ฟ ๐๐๐ฟ๐ผ๐ฝ๐ฒ ๐๐ฎ๐น๐น๐ ๐ข๐ฝ๐ฒ๐ป๐ถ๐ป๐ด:
• Low-power Edge AI Chips
• Accelerator for Advanced Strained Silicon on Insulator Substrates
• Open-source EDA tools development (second phase)
๐๐๐ฆ ๐ฅ&๐ ๐๐ฎ๐น๐น๐ ๐ข๐ฝ๐ฒ๐ป๐ถ๐ป๐ด:
• Boosting R&I cooperation between EU and Japan on semiconductors
• RISC-V Automotive Hardware Platform (second phase)
• AI-assisted Methods and Tools for Engineering Automation (second phase)
• Global RIA call (second phase)
• Global IA call according to SRIA 2025 (second phase)
๐ More information on the Chips JU website.
Please note: The second phase of the calls launched earlier this year will also open this upcoming month, exclusively for proposals that were successful in the first phase.
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The Marie Skลodowska-Curie Action (MSCA) European Innovative Training Network “PBNv2 - Next generation Pass-By Noise approaches for new powertrain vehicles” started in May 2017. Their research has the shared objective of investigating the possibilities to decrease pass-by noise of vehicles.
The project is a collaboration between 17 research institutions and companies in the European automotive R&D and provides a learning environment for 14 PhD fellows. The Belgian partner is the Noise and Vibration Research Group of KU Leuven, and this project is one of the many Horizon 2020 MSCA Innovative Training Networks that the KU Leuven research group participates in.
