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Published on | 10 months ago
ProgrammesThe Chips JU announces the opening of new calls on 8 July, aiming to drive progress in key areas of Europe’s semiconductor strategy by advancing low-power Edge AI design, enabling next-generation substrates, and strengthening international cooperation.
𝗖𝗵𝗶𝗽𝘀 𝗳𝗼𝗿 𝗘𝘂𝗿𝗼𝗽𝗲 𝗖𝗮𝗹𝗹𝘀 𝗢𝗽𝗲𝗻𝗶𝗻𝗴:
• Low-power Edge AI Chips
• Accelerator for Advanced Strained Silicon on Insulator Substrates
• Open-source EDA tools development (second phase)
𝗘𝗖𝗦 𝗥&𝗜 𝗖𝗮𝗹𝗹𝘀 𝗢𝗽𝗲𝗻𝗶𝗻𝗴:
• Boosting R&I cooperation between EU and Japan on semiconductors
• RISC-V Automotive Hardware Platform (second phase)
• AI-assisted Methods and Tools for Engineering Automation (second phase)
• Global RIA call (second phase)
• Global IA call according to SRIA 2025 (second phase)
🔗 More information on the Chips JU website.
Please note: The second phase of the calls launched earlier this year will also open this upcoming month, exclusively for proposals that were successful in the first phase.
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The UNCHAIN project, ‘urban logistics and planning: anticipating urban freight generation and demand including digitalisation of urban freight’ obtained funding from the Horizon Europe’s Mobility Cluster. The project focuses on breaking down data silos and promoting public-private data exchange across a unified European mobility data space, enabling more informed decisions and greater efficiency. The City of Mechelen is a partner in the project and takes on the role of ‘follower city’: it will work alongside the primary demonstration sites (in Madrid, Berlin and Florence) to maximize the geographical coverage and replicability of solutions across Europe. Mechelen aims to test 2 concrete solutions in the UNCHAIN project, with the aim to help addressing its current and future challenges in urban freight distribution.
