Published on | 3 weeks ago
Programmes Digital, Industry & Space SemiconductorsThe Chips JU announces the opening of new calls on 8 July, aiming to drive progress in key areas of Europe’s semiconductor strategy by advancing low-power Edge AI design, enabling next-generation substrates, and strengthening international cooperation.
๐๐ต๐ถ๐ฝ๐ ๐ณ๐ผ๐ฟ ๐๐๐ฟ๐ผ๐ฝ๐ฒ ๐๐ฎ๐น๐น๐ ๐ข๐ฝ๐ฒ๐ป๐ถ๐ป๐ด:
• Low-power Edge AI Chips
• Accelerator for Advanced Strained Silicon on Insulator Substrates
• Open-source EDA tools development (second phase)
๐๐๐ฆ ๐ฅ&๐ ๐๐ฎ๐น๐น๐ ๐ข๐ฝ๐ฒ๐ป๐ถ๐ป๐ด:
• Boosting R&I cooperation between EU and Japan on semiconductors
• RISC-V Automotive Hardware Platform (second phase)
• AI-assisted Methods and Tools for Engineering Automation (second phase)
• Global RIA call (second phase)
• Global IA call according to SRIA 2025 (second phase)
๐ More information on the Chips JU website.
Please note: The second phase of the calls launched earlier this year will also open this upcoming month, exclusively for proposals that were successful in the first phase.
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