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Open Access Call for Semiconductor Innovations

Published on | 2 weeks ago

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Digital, Industry & Space Semiconductors

The first APECS Pilot Line Open Access Call, starting on 1 April, invites companies, small and medium-sized enterprises (SMEs), startups, research and technology organisations (RTOs), and universities to submit project ideas for selected pilot line technologies. This initiative seeks to enable access to advanced infrastructure for semiconductor research and development. Participants can test and validate their semiconductor innovations using various available technologies, including:

  • Characterization, Test & Reliability (CTR)
  • Multi Project Wafer (MPW) runs
  • Integration & Packaging Technologies
  • Imaging Technologies, Post-CMOS Photonic Platform & IPD planar components.

For more information, visit the APECS website.

Background:

APECS is the Pilot Line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems. Co-funded by Horizon Europe, Digital Europe and Member State authorities, it brings together the technological competences, infrastructure, and know-how of ten partners from eight European countries: Germany (Fraunhofer-Gesellschaft as coordinator, FBH, IHP), France (CEA-Leti), Belgium (imec), Finland (VTT), Austria (TU Graz), Greece (FORTH), Spain (IMB-CNM, CSIC) and Portugal (INL).

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The Department of Economy, Science and Innovation of the Flemish government coordinates the Horizon 2020 Coordination and Support Action SAPHIRe, which started on 1 December 2018. The aim of the project is to secure the adoption of personalised medicine in all European regions, including sparsely populated and remote regions and regions with different innovation capacities. 

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