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Published on | 2 months ago
ProgrammesThe first APECS Pilot Line Open Access Call, starting on 1 April, invites companies, small and medium-sized enterprises (SMEs), startups, research and technology organisations (RTOs), and universities to submit project ideas for selected pilot line technologies. This initiative seeks to enable access to advanced infrastructure for semiconductor research and development. Participants can test and validate their semiconductor innovations using various available technologies, including:
For more information, visit the APECS website.
Background:
APECS is the Pilot Line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems. Co-funded by Horizon Europe, Digital Europe and Member State authorities, it brings together the technological competences, infrastructure, and know-how of ten partners from eight European countries: Germany (Fraunhofer-Gesellschaft as coordinator, FBH, IHP), France (CEA-Leti), Belgium (imec), Finland (VTT), Austria (TU Graz), Greece (FORTH), Spain (IMB-CNM, CSIC) and Portugal (INL).
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