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Published on | 5 months ago
ProgrammesThe APECS Pilot Line Open Access Call opens on 1 April. It aims to provide access to advanced semiconductor technologies for businesses, research organisations, and universities. Participants can submit project ideas to utilise top-tier R&D infrastructure for testing and validating their innovations.
The first APECS Pilot Line Open Access Call, starting on 1 April, invites companies, small and medium-sized enterprises (SMEs), startups, research and technology organisations (RTOs), and universities to submit project ideas for selected pilot line technologies. This initiative seeks to enable access to advanced infrastructure for semiconductor research and development. Participants can test and validate their semiconductor innovations using various available technologies, including:
For more information, visit the APECS website.
Background:
APECS is the Pilot Line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems. Co-funded by Horizon Europe, Digital Europe and Member State authorities, it brings together the technological competences, infrastructure, and know-how of ten partners from eight European countries: Germany (Fraunhofer-Gesellschaft as coordinator, FBH, IHP), France (CEA-Leti), Belgium (imec), Finland (VTT), Austria (TU Graz), Greece (FORTH), Spain (IMB-CNM, CSIC) and Portugal (INL).
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