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Published on | 9 months ago
ProgrammesThe Chips JU announces the opening of new calls on 8 July, aiming to drive progress in key areas of Europe’s semiconductor strategy by advancing low-power Edge AI design, enabling next-generation substrates, and strengthening international cooperation.
𝗖𝗵𝗶𝗽𝘀 𝗳𝗼𝗿 𝗘𝘂𝗿𝗼𝗽𝗲 𝗖𝗮𝗹𝗹𝘀 𝗢𝗽𝗲𝗻𝗶𝗻𝗴:
• Low-power Edge AI Chips
• Accelerator for Advanced Strained Silicon on Insulator Substrates
• Open-source EDA tools development (second phase)
𝗘𝗖𝗦 𝗥&𝗜 𝗖𝗮𝗹𝗹𝘀 𝗢𝗽𝗲𝗻𝗶𝗻𝗴:
• Boosting R&I cooperation between EU and Japan on semiconductors
• RISC-V Automotive Hardware Platform (second phase)
• AI-assisted Methods and Tools for Engineering Automation (second phase)
• Global RIA call (second phase)
• Global IA call according to SRIA 2025 (second phase)
🔗 More information on the Chips JU website.
Please note: The second phase of the calls launched earlier this year will also open this upcoming month, exclusively for proposals that were successful in the first phase.
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EURHISFIRM designs a world-class research infrastructure (RI) to connect, collect, collate, align, and share detailed, reliable, and standardized long-term financial, governance, and geographical data on European companies. EURHISFIRM enables researchers, policymakers, and other stakeholders to develop and evaluate effective strategies to promote investment, economic growth and job creation. The RI provides the tools for long-term analysis highlighting the dynamics of the past and the way those dynamics structure our present and future.
The EURHISFIRM European project received € 3.4 million in financing from the European Commission through the H2020-INFRADEV-2017-1 research infrastructures call. The project started with a consortium of eleven research organisations (including University of Antwerp) from seven European countries.
