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Published on | 2 years ago
ProgrammesThe interrelated calls for pilot lines issued by the Chips JU are now open for submission.
The calls for pilot lines include:
The same application is submitted to those calls and the evaluation will consist of the simultaneous evaluation of the interrelated calls.
All calls are open for submission on the Funding & Tenders Portal:
Pilot line on advanced sub 2nm leading-edge system on chip technology
Pilot line on advanced Fully Depleted Silicon On Insulator technologies targeting 7nm
Pilot line on advanced Packaging and Heterogenous Integration
Pilot line on advanced semiconductor devices based on Wide Bandgap materials
Deadline for submission is 29 February 2024, 17.00 CET (Brussels time).
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