New Chips JU calls open for submission (Horizon Europe & Digital Europe)

The Chips Joint Undertaking has opened a series of new calls under both the Horizon Europe and the Digital Europe programme.

The calls span the two pillars of the programme: Electronic Components and Systems (ECS), which funds research and innovation projects, and the Chips for Europe Initiative, which funds capacity building and infrastructure.

Calls with deadline 16 September 2026:

• HORIZON-Chips-JU-2026-FT1-IA: resilience call aiming to scale Europe’s power electronics to 300mm device production and adopt agile design
• HORIZON-Chips-JU-2026-FT2-IA: supports the industrial scale-up of advanced photonic platforms to bridge the gap between research and production
• HORIZON-Chips-JU-2026-FT3-IA: focuses on healthcare transformation via advanced imaging, home-based care, and high-performance instrumentation
• HORIZON-JU-Chips-2026-2-RIA: targets the design and implementation of integrated microelectronic building blocks for 6G radio communication Front End Modules
• HORIZON-JU-Chips-2026-3-RIA: fosters low-TRL collaboration with India, Singapore, and Taiwan on chip design, manufacturing, and packaging. 

Calls with deadline 22 September 2026:

• HORIZON-JU-CHIPS-2026-2-CSA: aims to enhance resilience by developing a "digital twin" data platform for monitoring disruptions and stress tests 
• HORIZON-JU-CHIPS-2026-SDV-CSA: coordinates European vehicle initiatives to establish an open reference architecture and sustainable roadmap

Calls with deadline 23 September 2006:

• DIGITAL-JU-CHIPS-2026-AI1-SG: first call of Stream A in the AI chips and systems for EU compute infrastructure initiative, aiming at AI chip demonstrators to support cutting-edge European chip designers to showcase operational silicon hardware ready for infrastructure integration
• DIGITAL-JU-CHIPS-2026-AI-GfP: Stream B in the AI chips and systems for EU compute infrastructure initiative, which will validate Stream A systems against workloads/benchmarks, and will procure pilot racks (Grant for Procurement)

Calls with deadline 24 September 2006:

• DIGITAL-JU-CHIPS-2026-SKILLS-PF-SG: networks European Vocational Education and Training (VET) providers to manage standardised qualification and certification systems for semiconductor technicians
• DIGITAL-JU-CHIPS-2026-SKILLS-SCD-CSA: seeks to inspire new generations to pursue semiconductor careers by funding student tape-out programmes and chip design challenges
• DIGITAL-JU-CHIPS-2026-SKILLS-HoE-SG: supports the creation of long-term excellence hubs for university and PhD education in specialised fields like chip design and manufacturing
• DIGITAL-JU-Chips-2026-SG-JAPAN: focuses on a chiplet ecosystem for AI and advanced process technologies for nodes beyond 2nm in partnership with Japanese consortia

Call with deadline 30 September 2026:

• HORIZON-JU-CHIPS-2026-IMAF-CSA: aims to design and pilot a comprehensive framework to systematically monitor, assess, and report the short-, medium-, and long-term impacts of the Chips JU programmes through standardised data, indicators, and methodologies