The Chips Joint Undertaking will launch five call topics under the Digital Europe Programme with an overall budget 65 M EUR in the form of Simple Grants or Coordination & Support Actions. The calls open on 7 July 2026 and close on 24 September 2026.

DIGITAL-JU-Chips 2026-DET-CSA: Call for Design Enablement Teams

• Scope/Objective: The Design Platform should act as a hub of services to support European companies engaged in chip design
• Budget: 5M EUR (0.5M EUR per project)
• Funding rate: 100% of eligible costs

DIGITAL-JU-CHIPS-2026 -SKILLS-HoE-SG: Skills Hubs of Excellence

• Scope/Objective: Each action should set up a ‘Hub of Excellence’ to support high education topics for skills development to address talent shortages and increase capacities
• Budget: 20M EUR (4M EUR per project)
• Funding rate: 50% of eligible costs

DIGITAL-JU-CHIPS-2026 -SKILLS-PF-SG: Pilot Federation

• Scope/Objective: Support to bridge the talent gap in semiconductors through coordinated efforts from relevant public and private stakeholders. The federation should manage mutual recognition of international systems for training, qualification and certification in the semiconductor sector
• Budget: 10M EUR (10M EUR per project)
• Funding rate: 50% of eligible costs

DIGITAL-JU-CHIPS-2026 -SKILLS-SCD-CSA: Stimulation of Chip Design

• Scope/Objective: Implementation of a comprehensive Chip Design Skills Programme to strengthen Europe’s advanced design capabilities in integrated semiconductor technologies
• Budget: 15M EUR
• Funding rate: 100% of eligible costs

DIGITAL-JU-Chips-2026-SG-JAPAN: International collaboration - Joint call EU and Japan on semiconductors

• Scope/Objective: Foster a robust chiplet ecosystem to enable heterogeneous integration for the AI stack including integrated photonics. Proposers are expected to work closely with Japanese organisations
• Budget: 5M EUR EU contribution, with a comparable commitment expected from Japanese organisations
• Funding rate: 50% of eligible costs